Magenta.
CICOR
The Cicor Group is a globally active provider of full-cycle electronic solutions from research and development to manufacturing and supply chain management. Cicor’s approximately 2,500 employees at 15 locations are serving leaders from the medical, industrial and aerospace & defense industries. Cicor creates value to its customers through the combination of customer-specific development solutions, high-tech components, as well as electronic device manufacturing.
HYBRID CIRCUITS
Thin-film substrates are used where conventional PCB technologies cannot provide an adequate technical solution. Rigid and flexible multilayer circuits with highest resolution (10 μm) can be manufactured. Thin-film technology is using semiconductor and microsystem technologies to produce circuit carriers on ceramic or organic materials.
The conductor tracks in the thick-film technology are applied by screen printing and then burned in. The use of ceramic as substrate enables highest reliability under the harshest environmental conditions. A thick-film circuit is clearly superior to the standard PCB in terms of temperature resistance and service life.
For more information on hybrid solutions (thin and thick film substrates)
PRINTED ELECTRONICS
The increasing number of electronic devices in more and more applications requires new manufacturing technologies to be developed and industrialized. Flexible additive manufacturing processes play a key role in substrate manufacturing and connection technology.
Aerosol Jet Printing technology enables a wide range of conductive, non-conductive and biocompatible materials to be printed on a wide range of substrates and shapes. In addition, new opportunities exist for interconnect technologies that lead to performance improvements.
For more information on printed electronics
PRINTED CIRCUIT BOARDS
For over 55 years, Cicor has been developing and producing sophisticated flexible, rigid-flexible and rigid printed circuit boards (PCBs), from the idea, through prototypes, to large-series production. Thanks to a comprehensive expertise in multilayer boards (MLBs) and high-density interconnects (HDIs), Cicor develops innovative and reliable solutions for demanding applications in medical, aerospace and defence and industrial markets.
Thin materials and line width and spacing down to 25 µm (1 mil) enable extreme miniaturization and ultra-HDI advanced solutions. DenciTec® technology opens up completely new possibilities.Innovative circuits can be produced by combining our PCB processes with our thin-film technology.